Hero Int

Alliance for Manufacturing and Technology

New York State Foundation for Science, Technology and Innovation

NYSTAR will help identify potential funding sources for new initiatives. Call Matt Watson at 518-292-5729  for details on a partnership in:

Acoustic Sensing:

  • Microacoustic Sensors - Development of small-scale directional microphones with reduced power requirements.
  • Bioacoustics Detection, Classification, and Tracking - Development and analysis of acoustic information from biological sources: technology to track marine wildlife.

Advanced Systems and Software Development:

  • Model Based System Design with SystemC Virtual Prototypes.
  • Massively Parallel Radar Pulse Deinterleaving - Creating a simulation test bed for development of advanced, parallelized radar pulse processing algorithms.
  • RF Distributed Sensing for Target Detection, Tracking, and Imaging - Develop enhanced capabilities to perform target detection, tracking and imaging.

Materials and Thermal Management:

  • Modeling and Characterization Studies of Thermal Interface Materials - Combine empirical data and physics-based models to develop the next generation of optimized application specific thermal interface materials.
  • Self-Healing Composite Materials - Embedding capsules into polymer matrix facilitates self-healing, allowing materials to retain structural integrity after delaminating events.
  • Thermal Management - Develop a systems level thermal modeling and analysis tool.

Processes and Materials for Flexible Electronics:

  • Flexible Roll to Roll Electronics - Develop techniques for economic production of large panel assemblies of flexible electronics.
  • Characteristics of Low-Temperature Sintered Inks - Developing nanoparticle-based inks to enable inkjet fabrication of electronic devices
  • Economical, Efficient, and Stable Antireflective Coatings and Flexible Antenna Elements: High-K Dielectric Coatings - Advanced high-K dielectric and non-reflective coatings will make higher density RF-Digital mixed-signal circuits and multi-chip modules feasible.

Next Generation Hardware Devices:

  • Nanoelectronic Transmission Lines - Developing electrical and thermal interconnect structures for next-generation IC geometries
  • REAPER (Reconfigurable and Programmable Electronics Research Lab) - Reconfigurable analog circuits for rapid prototyping and development of low-power, high-performance RF signal processing solutions.
  • MEMS Filters - Demonstrate CMOS compatible RF filters with MEMS-based resonators.
  • High Performance Switching Using Optofluidics - Developing new devices for reconfigurable optical switching based on nanopartical liquid core waveguides. Electrically controlled switching of fiber optics.
  • Next Generation High Power GaN RF and Switching Transistors - In semiconductors for high-frequency microwave amplification and high-voltage switching applications.
  • 3D Hyper-Integration: Replacing PCBs with Integrated Circuits - Develop the capability to vertically stack and interconnect multiple materials, technologies and functional components to form highly integrated micro-nano-systems and integrated circuits.
  • Terahertz on Graphene and CMOS - Graphene-based materials and devices for ultra-high speed applications. Terahertz imaging for security and concealed weapons detection.